MIPS, a global leader in RISC-V processor IP, and Cyient Semiconductor, an India-based chip design company, have announced a strategic partnership to develop advanced semiconductor solutions for power management and intelligent automation. The collaboration targets real-time, safety-critical use cases in automotive systems, industrial robotics, and data centre power delivery.
Together, the companies will co-design application-specific integrated circuits (ASICs) and application-specific standard products (ASSPs) using MIPS’ Atlas RISC-V processor IP and Cyient’s expertise in analog and mixed-signal design. The resulting platforms will offer high performance, compute efficiency, and improved motor control tailored to edge and embedded workloads.
Addressing demand from software-driven industries
This collaboration arrives amid rising global demand for intelligent chipsets in software-controlled vehicles, factory automation, and scalable data infrastructure. The solutions will support domains such as real-time decision-making in automotive safety systems and high-efficiency power management for data centres.
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Cyient will lead system design and integration, while MIPS contributes its M8500-series microcontrollers and RISC-V-based CPU cores. According to the companies, their open architecture will help original equipment manufacturers (OEMs) and system integrators reduce time-to-market, avoid vendor lock-ins, and maintain flexibility in evolving ecosystems.
The products will be offered in both ASIC and ASSP formats, allowing partners to scale solutions depending on complexity, cost, and long-term needs.
Designed for a connected, power-efficient future
The goal of this joint effort is to build domain-specific chips that enable smarter, more energy-efficient systems without sacrificing performance. As compute demands shift from centralized clouds to edge environments, optimised silicon solutions become essential for embedded intelligence.
By bringing together MIPS’ processor leadership and Cyient’s power delivery expertise, the partnership aims to fuel a new wave of connected innovations—from autonomous mobility to next-generation factory systems and data centre efficiency.
